職位描述
該職位還未進行加V認證,請仔細了解后再進行投遞!
RESPONSIBILITIES:
? Construct the product system architecture with the ability to make interdisciplinary trade-offs to optimize for the best cost/performance/time.
? Responsible for headset electrical detailed design (including test and debug) with cross-function team and ODM supplier, conduct design review before design release for production tooling
? Define product requirements and specifications (mechanical, electrical, acoustic, firmware) and test document as necessary to ensure desired quality and performance of the product
? Building an efficient communication bridge to ODM supplier with worldwide development teams across multiple disciplines (Product Manager, QA, Ops, 3rd party supplier etc.)
? Provide global technical support to other non-engineering functions on key technologies and past, present, and future products
? Develop new technologies/technology platforms
REQUIREMENTS
? 6 years experience in product development of electronic products, 2 years experience as a lead of ODM projects is a must.
? Bachelor degree in electrical engineering discipline or similar.
? Strong consumer electronic industrial background. Wireless and audio working experience will be a plus.
? Rich design experience for high volume manufacture of consumer electronic product.
? EDA experience in validating schematic and PCB/A layout, prototype bring-up and debugging between Engineering team and ODM, lead team to meet requirement of EMC/EMI, ESD, RF, reliability etc.
? Thorough understanding of, and ability to clearly explain, EE concepts such as A/D, DC/DC supply, RF gain compression, EMI noise suppression techniques, SWR and power measurement
? Strong electrical engineering background with clear understanding of software/firmware development. Track record of learning and understanding other engineering disciplines (software, firmware, mechanical, acoustic)
? Broad exposure to many engineering disciplines: Electrical, Mechanical, Software, Systems, Acoustics
? Strong written and oral communication skills in both English and Mandarin, and strong interpersonal skills
? Ability to work with others in a widely-disbursed, fast-paced team environment
? Excellent time management and organizational skills
HIGHLY DISIRERABLE
? Experience/knowledge of RF design and antenna design for wireless systems
? Experience /knowledge of embedded system design and coding
? Experience working with global engineering team and product management to define products and make tradeoffs
? Experience mentoring junior engineers for technical skills and soft skills
工作地點
地址:蘇州吳中區(qū)蘇州-工業(yè)園區(qū)繽特力通訊科技公司
??
點擊查看地圖
詳細位置,可以參考上方地址信息
求職提示:用人單位發(fā)布虛假招聘信息,或以任何名義向求職者收取財物(如體檢費、置裝費、押金、服裝費、培訓費、身份證、畢業(yè)證等),均涉嫌違法,請求職者務必提高警惕。
職位發(fā)布者
HR
中國惠普有限公司
-
計算機硬件·網絡設備
-
1000人以上
-
中外合資(合資·合作)
-
朝陽區(qū)建國路112號中國惠普大廈
相似職位
-
管理分區(qū)負責人(儲備) 15000-20000元3年以上 大專百麗鞋業(yè)(上海)有限公司
-
平安優(yōu) 計劃 面議應屆畢業(yè)生 不限中國平安人壽保險股份有限公司江蘇分公司
-
保險醫(yī)養(yǎng)顧問 8000元以上應屆畢業(yè)生 不限中國平安人壽保險股份有限公司江蘇分公司
-
保險康養(yǎng)顧問-ZH 面議應屆畢業(yè)生 大專中國平安人壽保險股份有限公司江蘇分公司
-
海外市場 9000-14000元應屆畢業(yè)生 本科北京德惠眾合信息技術有限公司
-
金屬材料理化檢驗 1000元以下應屆畢業(yè)生 大專南京厚固新能源科技有限公司

應屆畢業(yè)生
本科
2026-01-28 05:29:52
3434人關注
注:聯系我時,請說是在江蘇人才網上看到的。
